Ping Yang

Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load

Bing Yang, Yongle Hu, Dongbo Li, 2020 .

The thermal-structural analysis of plastic substrate based display using experiments and FEM simulations

Leon Xu, Ming-quan Shi, A. Salo, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Thermal analysis based on the environmental tests of STN display

Leon Xu, Antti Salo, Cherie Jing, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Research of fractional order chaotic system based on time-frequency domain method

Ping Yang, Xiaodan Liu, Zhi-sheng Zhang, 2013, 2013 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE).

Vibrational fatigue and reliability of package-on-package stacked chip assembly

Haiying Yang, Ping Yang, Bing Yang, 2019, Microelectron. J..

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi-Shao Lai, Chang-Lin Yeh, Ping-Feng Yang, 2006, Microelectron. Reliab..

A Method for Modeling and Simulation of Differential Drive Mobile Robot Localization Based on EKF Multisensor Fusion

Ping Yang, Hu Wen Cao, Bi Zhen Bao, 2011 .

Design of Rotate Speed Sensor Based on MR Elements

Ping Yang, Kun Jiang, Ren Tian Ma, 2012 .

Failure analysis and reliability reinforcement on gold wire in high-power COB-LED under current and thermal shock combined loading

Haiying Yang, Bing Yang, Junchao Li, 2019, Applied Thermal Engineering.

Passivity-based stability analysis of parallel single-phase inverters with hybrid reference frame control considering PLL effect

Frede Blaabjerg, Lin Xu, Yang Han, 2022 .