Peilun Yao
发表
H. Fan,
Haibin Chen,
Civen Li,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Jingshen Wu,
H. Fan,
Haibin Chen,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Jingshen Wu,
Haibin Chen,
Peilun Yao,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
M. Zahran,
P. Xue,
Peilun Yao,
2019,
Latin American Journal of Solids and Structures.
Jingshen Wu,
Jinglei Yang,
Haibin Chen,
2021,
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
H. Fan,
Haibin Chen,
Peilun Yao,
2023,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
Pu Xue,
Zeliang Yu,
Peilun Yao,
2020
.
Jingshen Wu,
Haibin Chen,
Peilun Yao,
2022,
Chemical Engineering Journal.