D. F. Baldwin

发表

Initial development work on a high throughput low cost flip chip on board assembly process

L. P. Mcgovern, D. F. Baldwin, 1997 .

Flip chip with lead-free solders on halogen-free microvia substrates

D. F. Baldwin, K. Boustedt, G. Baynham, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

An innovative underfill process for high-speed SMT CSP BGA flip chip assembly

Jian Zhang, D. F. Baldwin, 2003, IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..

Preliminary in-process stress analysis of flip-chip assemblies during underfill

D. F. Baldwin, P. Palaniappan, 1997 .

Processing strategies for high speed 0201 implementation

Brian J. Lewis, D. F. Baldwin, P. N. Houston, 2002, 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.

Lead-free flip chip processing with halogen-free high density microvia substrates

Fredrik Mattsson, Anette Johansson, D. F. Baldwin, 2000, Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146).

Modular, device-scale, direct-chip-attach packaging for microsystems

D. F. Baldwin, J. Neysmith, 2001 .

Application assessment of high throughput flip chip assembly for a high lead-eutectic solder cap interconnect system using no-flow underfill materials

D. F. Baldwin, D. Milner, 2001 .

Smart tooling for assembly of thin flexible systems

D. F. Baldwin, Ruijun Chen, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

A reliability and failure mode analysis of no flow underfill materials for low cost flip chip assembly

D. F. Baldwin, D. Baldwin, R. Thorpe, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials

L. P. Mcgovern, D. F. Baldwin, D. Baldwin, 2001 .

HIGH-THROUGHPUT, LOW-COST FLIP CHIP-ON-BOARD ASSEMBLY

L. P. Mcgovern, D. F. Baldwin, D. Baldwin, 1998 .

Flux-underfill compatibility and failure mode analysis in high yield flip chip processing

D. F. Baldwin, P. N. Houston, D. Baldwin, 2000, 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.

Flip chip interconnect systems using wire stud bumps and lead free solder

D. F. Baldwin, S. Zama, T. Hikami, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).