H. Sakurai

发表

Influence of Ambient Temperature and Wind Velocity on Egg Production of Japanese Quail

H. Sakurai, 1983 .

Transport Anisotropy of Resistivity and Critical Current Density in Sputtered Y1Ba2Cu3O7−y Films

C. Takahashi, M. Nagano, Y. Wakiya, 1995 .

Productive Responses by Environment and Feed Composition in Japanese Quail

H. Sakurai, 1984 .

Influence of Dietary Levels of Protein and Energy on Nitrogen and Energy Balance for Egg Production of Japanese Quail

H. Sakurai, 1981 .

Influence of Level of Protein and Energy of Rearing Diet on Growth, Feed Efficiency and Egg Production of Japanese Quail

H. Sakurai, 1979 .

Influence by Medium and High Temperature Period of Dietary Levels of Protein and Energy on Egg Laying Performance of Japanese Quail

H. Sakurai, 1979 .

Carotenoid and Cholesterol Contents of Quail Eggs under Feeding of Alfalfa Leaf Protein Concentrate

H. Sakurai, H. Yokota, M. Ohshima, 1995 .

Expression profiles of Insulin-like growth factor binding protein-like 1 in the developing mouse forebrain.

H. Tabata, K. Nakajima, I. Ajioka, 2007, Gene expression patterns : GEP.

Influence of Ambient Temperature and Light Length for The Rearing Term on Growth and Egg Production Characteristics of Japanese Quail

H. Sakurai, 1983 .

Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability

K. Suganuma, Seongjun Kim, Keun-Soo Kim, 2010 .

Determinations of Metabollizable Energy Values of Common Feedstuffs for Laying Quail

H. Sakurai, 1978 .

Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish

Kiju Lee, Hitoshi Sakurai, Katsuaki Suganuma, 2012, Microelectron. Reliab..

Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish

K. Suganuma, Seongjun Kim, Keun-Soo Kim, 2010 .

Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound

K. Suganuma, H. Sakurai, S. Kumamoto, 2008 .

Joints Soldered on Electroless Ni-Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement

K. Suganuma, Kazuki Ikeda, H. Sakurai, 2005 .

Flux for Stronger Solder Joints on Ni-P/Au Electrodes

K. Suganuma, H. Sakurai, S. Kumamoto, 2008 .