X. Zhang

Development of fluxless bonding using deposited Gold-indium multi-layer composite for heterogeneous silicon micro-cooler stacking

Yong Han, H. Zhang, B. L. Lau, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Virtual Prototyping based Design Optimization of the Substrate, Leadframe, and Flip Chip Package Families with Low-k Technology

S. Orain, W.D. van Driel, T. Hauck, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Mechanism of Moldable Underfill(MUF) process for fan-out wafer level packaging

F. X. Che, M. Z. Ding, L. Bu, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Thermal characterization and simulation study of 2.5D packages with multi-chip module on through silicon interposer

Liang Ding, X. W. Zhang, S. Lim, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

Study of Thermally Enhanced 2.5D Packages with Multi-chips Molded on Silicon Interposer

H. Y. Zhang, Xiaowei Zhang, X. Zhang, 2015, Journal of Electronic Materials.