Takuya Kadoguchi

Highly thermostable joint of Cu/Ni plating/composite Sn–0.7Cu solder with added Cu balls for die attachment in power modules

K. Suganuma, S. Nagao, Takuya Kadoguchi, 2018, Journal of Materials Science: Materials in Electronics.

Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls

K. Suganuma, S. Nagao, Takuya Kadoguchi, 2017, Journal of Materials Science.

Solder electromigration behavior in Cu/electroless Ni–P plating/Sn–Cu based joint system at low current densities

K. Suganuma, S. Nagao, Takuya Kadoguchi, 2015 .

Effect of Sn crystallographic orientation on solder electromigration and Ni diffusion in Cu/Ni plating/Sn–0.7Cu joint at low current density

K. Suganuma, S. Nagao, Takuya Kadoguchi, 2017, Journal of Materials Science: Materials in Electronics.

Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density

Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma, 2015, Microelectron. Reliab..

Evaluation of the number density of nuclei in Li2O·2SiO2 glass by DTA method

T. Wakasugi, Takuya Kadoguchi, R. Ota, 2001 .

Electromigration of Ni Plating/Sn-0.7Cu Based Joint System of Power Modules for Hybrid Vehicles

Takuya Kadoguchi, N. Take, K. Yamanaka, 2017 .