N. Take

Highly thermostable joint of Cu/Ni plating/composite Sn–0.7Cu solder with added Cu balls for die attachment in power modules

K. Suganuma, S. Nagao, Takuya Kadoguchi, 2018, Journal of Materials Science: Materials in Electronics.

Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls

K. Suganuma, S. Nagao, Takuya Kadoguchi, 2017, Journal of Materials Science.

Effect of Sn crystallographic orientation on solder electromigration and Ni diffusion in Cu/Ni plating/Sn–0.7Cu joint at low current density

K. Suganuma, S. Nagao, Takuya Kadoguchi, 2017, Journal of Materials Science: Materials in Electronics.

Self‐Healing Technology for Metallic Die Attach Materials in Electronics

E. Dede, S. Joshi, N. Take, 2019, Advanced Engineering Materials.

Error prevention in robotic assembly tasks by a machine vision and statistical pattern recognition method

N. Okino, S. Okumura *, N. Take, 2005 .

Study of Randomly Distributed Charge Traps by Measuring Frequency- and Time-Dependence of a DNTT-Based MIS Capacitor

T. Someya, T. Sekitani, A. Fujiwara, 2015, Journal of Display Technology.

Alternating current admittance of DNTT-based metal-insulator-semiconductor capacitors

T. Someya, T. Sekitani, H. Tamura, 2014 .

Electromigration of Ni Plating/Sn-0.7Cu Based Joint System of Power Modules for Hybrid Vehicles

Takuya Kadoguchi, N. Take, K. Yamanaka, 2017 .

Sheet-Type Flexible Organic Active Matrix Amplifier System Using Pseudo-CMOS Circuits With Floating-Gate Structure

M. Takamiya, Tsung-Ching Huang, T. Sakurai, 2012, IEEE Transactions on Electron Devices.