Deok-Gon Han

Interfacial reactions and mechanical strength ofSn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

S. Jung, Jeong-Won Yoon, S. Yoo, 2017 .

Effect of interfacial reaction layer on the brittle fracture of the SAC305 solder joint on ENIG and ENEPIG surface finish

Sang-Hyun Kwon, Chang-Woo Lee, S. Yoo, 2012 .

Brittle fracture behavior and interfacial reaction of Sn-Ag-Cu solders on ENIG and ENEPIG surface finish

Sang-Hyun Kwon, Chang-Woo Lee, S. Yoo, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints

S. Jung, Jeong-Won Yoon, S. Yoo, 2018, Journal of Welding and Joining.

Interfacial microstructure and brittle fracture behavior of Sn-based solder on novel nickel-less DEG and EPIG surface finishes

So-Yeon Jun, Jungsoo Kim, S. Yoo, 2023, Journal of Materials Science: Materials in Electronics.

Solderability of thin ENEPIG plating Layer for Fine Pitch Package application

S. Jung, Jeong-Won Yoon, Byung-suk Lee, 2017 .

Inductively coupled plasma nitriding of chromium electroplated AISI 316L stainless steel for PEMFC bipolar plate

Jung Joong Lee, Hyoseok Choi, Wonhyuk Hong, 2009 .

Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

So-Yeon Jun, Junghwan Bang, S. Yoo, 2023, Materials.