Jiunn Chen

Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Y. Lai, S. Jian, Ping-Feng Yang, 2008 .

Identification of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds using nanoindentation

Y. Lai, S. Jian, Ping-Feng Yang, 2007, 2007 International Microsystems, Packaging, Assembly and Circuits Technology.

Structural and elastic properties of Cu 6 Sn 5 and Cu 3 Snfrom first-principles calculations

Yi-Shao Lai, Ping-Feng Yang, Jiunn Chen, 2009 .

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Y. Lai, Y. Chiu, Jiunn Chen, 2008, 2008 58th Electronic Components and Technology Conference.

Electromigration reliability and morphologies of Cu pillar flip-chip solder joints

Y. Lai, C. Lee, Y. Chiu, 2008, ECTC 2008.

Theoretical Approach Towards Elastic Anisotropy and Strain-Induced Void Formation in Cu-Sn Crystalline Phases

Yi-Shao Lai, Jiunn Chen, Y. Lai, 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.

First-principles calculations of elastic properties of Cu3Sn superstructure

Yi-Shao Lai, Jiunn Chen, Chung-Yuan Ren, 2008 .

Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding

Yi-Shao Lai, Jiunn Chen, Yi-Wun Wang, 2011, Microelectron. Reliab..

Mechanical Properties ofCu6Sn5, Cu3Sn, andNi3Sn4 Intermetallic CompoundsMeasured by Nanoindentation

Y. Lai, S. Jian, Ping-Feng Yang, 2007 .