Anshi Ren

发表

Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times

Gong Zhang, Gao-qiang Chen, Q. Shi, 2021, Microelectronics Reliability.

Contrastive Study on Shear Strength and Fracture Mechanism of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu Solder Joints with Aging Treatment

Gong Zhang, Anshi Ren, Shiliang Gong, 2022, International Conference on Electronic Packaging Technology.