Zongjie Han

发表

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

S. Xue, Hui Wang, Jianxin Wang, 2009 .

Reaction mechanism between oxide film on surface of Al-Li alloy and CsF-AlF3 flux

S. Xue, Xiang Huang, Zongjie Han, 2008 .

Effects of Ag on microstructures, wettabilities of Sn–9Zn–xAg solders as well as mechanical properties of soldered joints

S. Xue, W. Chen, Hui Wang, 2010 .

Investigation on properties of Ga to Sn–9Zn lead-free solder

S. Xue, Hui Wang, Jianxin Wang, 2010 .

Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

S. Xue, Jianxin Wang, Li Yao, 2006 .

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

Lili Gao, Peng Xue, Sheng-lin Yu, 2011 .

Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments

Sheng-lin Yu, Songbai Xue, Zongjie Han, 2009 .

Effects of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints

S. Xue, Hui Wang, Jianxin Wang, 2009 .

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

S. Xue, Liang Zhang, Jianxin Wang, 2009 .

Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

Sheng-lin Yu, Hui Wang, Zongjie Han, 2008 .