Zhenyu Kong

Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors

Ranga Komanduri, Satish T. S. Bukkapatnam, Prahalad K. Rao, 2014, IEEE Transactions on Semiconductor Manufacturing.

Process Performance Prediction for Chemical Mechanical Planarization (CMP) by Integration of Nonlinear Bayesian Analysis and Statistical Modeling

Ranga Komanduri, Asil Oztekin, Zhenyu Kong, 2010, IEEE Transactions on Semiconductor Manufacturing.

Assessment of Dimensional Integrity and Spatial Defect Localization in Additive Manufacturing Using Spectral Graph Theory

Zhenyu Kong, Chad E. Duty, Lonnie J. Love, 2016 .

Machine learning–driven in situ process monitoring with vibration frequency spectra for chemical mechanical planarization

Jia Liu, Jingyi Zheng, Zhenyu Kong, 2020, The International Journal of Advanced Manufacturing Technology.

An integrated manifold learning approach for high-dimensional data feature extractions and its applications to online process monitoring of additive manufacturing

Zhenyu Kong, Chenang Liu, S. S. Babu, 2020, IISE Trans..

Nonlinear Sequential Bayesian Analysis-Based Decision Making for End-Point Detection of Chemical Mechanical Planarization (CMP) Processes

R. Komanduri, Zhenyu Kong, O. Beyca, 2011, IEEE Transactions on Semiconductor Manufacturing.