Chih-Tang Peng

Analysis and Validation of Sensing Sensitivity of a Piezoresistive Pressure Sensor

Chun-Te Lin, Chih-Tang Peng, Ji-Cheng Lin, 2003 .

Reliability analysis and design for the fine-pitch flip chip BGA packaging

Chih-Tang Peng, Ji-Cheng Lin, Kuo-Ning Chiang, 2004 .

DESIGN AND ANALYSIS OF THE CMOS COMPATIBLE PRESSURE SENSOR USING FLIP CHIP AND FLEX CIRCUIT BOARD TECHNOLOGIES

Chang-Chun Lee, Chih-Tang Peng, Kuo-Ning Chiang, 2003 .

Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip

Chih-Tang Peng, Kuo-Ning Chiang, Chia-Tai Kuo, 2006, Microelectron. Reliab..

Optimal Design for Thermal Performance of a Heat Sink Integrated With Thermoelectric Cooler

C. J. Fang, Chih-Tang Peng, Ming C. Wu, 2005 .

Packaging effect investigation of CMOS compatible pressure sensor using flip chip and flex circuit board technologies

Chang-Chun Lee, Chih-Tang Peng, Kuo-Ning Chiang, 2006 .

Failure life prediction and factorial design of lead‐free flip chip package

Chih-Tang Peng, Kuo-Ning Chiang, Chung-Jung Wu, 2007 .

Parametric reliability analysis of no-underfill flip chip package

Chih-Tang Peng, Kuo-Ning Chiang, Zheng-Nan Liu, 2001 .

Experimental characterization and mechanical behavior analysis on intermetallic compounds of 96.5Sn-3.5Ag and 63Sn-37Pb solder bump with Ti-Cu-Ni UBM on copper chip

Chih-Tang Peng, Kuo-Ning Chiang, Chia-Tai Kuo, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology

Chun-Te Lin, Chih-Tang Peng, Ji-Cheng Lin, 2005 .

Design, fabrication and comparison of lead-free/eutectic solder joint reliability of flip chip package

Chih-Tang Peng, Kuo-Ning Chiang, T. Ku, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Analysis and validation of thermal and packaging effects of a piezoresistive pressure sensor

Chun-Te Lin, Chih-Tang Peng, Ji-Cheng Lin, 2004 .