Chengxin Li

发表

H. Nishikawa, J. Jiu, Siliang He, 2021, Journal of Materials Science: Materials in Electronics.

H. Nishikawa, Sijie Huang, Chengxin Li, 2019, 2019 International Conference on Electronics Packaging (ICEP).

X. Hou, Hu-Lin Liu, Changqing Liu, 2021, Ceramics International.

Dashan Zhang, Xiaodong Sun, Jiewen Huang, 2019, Journal of Wuhan University of Technology-Mater. Sci. Ed..

Zhongxin Liu, Chengxin Li, Z. Gao, 2021, Frontiers of Materials Science.

Yuchen Tang, Xuliang Zhang, Jiangfeng Song, 2021, International Journal of Metalcasting.