Richard Joseph Saia

Characterization Of A Submicron Image Reversal Process

Ernest Wayne Balch, Stanton Earl Weaver, Richard Joseph Saia, 1988, Advanced Lithography.

Accurate design of solder joints for passive alignment of a vertical emitting laser to a planar polymeric waveguide via a 45-degree mirror

Matthew Christian Nielsen, Min-Yi Shih, Richard Joseph Saia, 2003, SPIE Optics + Photonics.

Reliability evaluation of chip-on-flex CSP devices

Richard Joseph Saia, R. A. Fillion, B. Burdick, 1998, Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).

Demonstration of integral passives on double sided polyimide flex

E. J. Rymaszewski, Richard Joseph Saia, Herbert Stanley Cole, 2000 .

Advanced 3-D stacked technology

Robert J. Wojnarowski, Christopher James Kapusta, Richard Joseph Saia, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Three dimensional hybrid wafer scale integration using the GE high density interconnect technology

Richard Joseph Saia, Raymond Albert Fillion, B. Gorowitz, 1993, 1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration.

3-D stacking using the GE high density multichip module technology

Robert J. Wojnarowski, Richard Joseph Saia, Raymond Albert Fillion, 1994, Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies.

Silicon carbide UV photodiodes

Richard Joseph Saia, J. M. Pimbley, James W. Kretchmer, 1993 .

A novel high-frequency power FET structure fabricated using LPCVD WSi/sub 2/ gate and LCPVD W source contact technology

Krishna Shenai, Bantval J. Baliga, B. J. Baliga, 1988, Technical Digest., International Electron Devices Meeting.