Janggil Kim

Thermo-mechanical simulation of BCB membrane thin-film package

N. Rolland, P. Rolland, S. Bouwstra, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Planar metal–insulator–semiconductor type field emitter fabricated on an epitaxial Al/Al2O3/Si (111) structure

M. Ishida, K. Sawada, Janggil Kim, 2004 .

Polymer-based zero-level packaging technology for high frequency RF applications by wafer bonding/debonding technique using an anti-adhesion layer

N. Rolland, P. Rolland, S. Seok, 2012 .

Low-temperature, low-loss zero level packaging techniques for RF applications by using a photopatternable dry film

N. Rolland, P. Rolland, S. Seok, 2012 .

Electrical Characteristics of Epitaxial γ-Al2O3/Si for Quantum Tunneling Device

M. Ishida, K. Sawada, M. Shahjahan, 2006 .

Wide-band millimetre-wave antenna based on Si and suspended BCB membrane

N. Rolland, L. Dussopt, H. Salti, 2015 .

Low-temperature zero-level packaging technique using photosesitive film type PerMX polymer

S. Seok, Janggil Kim, N. Rolland, 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.

Low-Temperature Photosesitive Film-Type Permx Polymer Zero-Level Packaging Technique for RF Applications

N. Rolland, P. Rolland, S. Seok, 2014 .