J. Tu

发表

Deposition and wettability of silver nanostructures on Si(1 0 0) substrate based on galvanic displacement reactions

Tong-Yi Zhang, C. Gu, J. Tu, 2010 .

Correlating the thermal contact resistance between metal/erythritol interfaces with surface roughness and contact pressure

Liwu Fan, Zitao Yu, Feng Biao, 2021 .

A molecular dynamics study of the effects of crystalline structure transition on the thermal conductivity of pentaerythritol as a solid-solid phase change material

Liwu Fan, B. Feng, Feng Biao, 2019, International Journal of Heat and Mass Transfer.

Close-contact melting heat transfer on a heated horizontal plate: Revisited in the presence of nano-enhanced phase change materials (NePCM)

Liwu Fan, J. Tu, Nan Hu, 2018, International Journal of Heat and Mass Transfer.

Unconstrained Melting Heat Transfer of Nano-Enhanced Phase-Change Materials in a Spherical Capsule for Latent Heat Storage: Effects of the Capsule Size

Liwu Fan, J. Tu, Nan Hu, 2019, Journal of Heat Transfer.

Experimental Investigation of Heat Storage and Heat Transfer Rates during Melting of Nano-Enhanced Phase Change Materials (NePCM) in a Differentially-Heated Rectangular Cavity

Liwu Fan, J. Tu, Nan Hu, 2020 .

A universal sensitivity matrix reduction technique (SMART) to uncover governing thermal transport relationships

W. Ong, J. Tu, 2023, International Journal of Heat and Mass Transfer.

Temperature-mediated structural evolution of vapor–phase deposited cyclosiloxane polymer thin films for enhanced mechanical properties and thermal conductivity

W. Du, Junjie Zhao, Yingwu Luo, 2023, International Journal of Extreme Manufacturing.

An improved steady-state method for measuring the thermal contact resistance and bulk thermal conductivity of thin-walled materials having a sub-millimeter thickness

Liwu Fan, Zitao Yu, Feng Biao, 2020 .

Determination on the thermal conductivity and thermal contact resistance of thin composite phase change films as a thermal interfacial material

Liwu Fan, Zitao Yu, B. Feng, 2022, Case Studies in Thermal Engineering.