Puru Bruce Lin
发表
Pei-Chen Huang,
Chang-Chun Lee,
Yan-Yu Liou,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2020,
International Symposium on Microelectronics.
Puru Bruce Lin,
Cheng-Ta Ko,
Yu-Hua Chen,
2017,
2017 International Conference on Electronics Packaging (ICEP).
A Novel Warpage Reinforcement Architecture with RDL Interposer for Heterogeneous Integrated Packages
Chi-Wei Wang,
Chang-Chun Lee,
Puru Bruce Lin,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Puru Bruce Lin,
Yu-Hua Chen,
Dyi-Chung Hu,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.