Y. H. Chew

First-principles simulation study on the effects of dopants on the cohesion of gold grain boundary

C.C. Wong, Y. H. Chew, Z. Bakar, 2007, 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces.

The effects of Ca and Pd dopants on gold bonding wire and gold rod

T. Sritharan, C. C. Wong, S. Mhaisalkar, 2004 .

Strain rate sensitivity and Hall–Petch behavior of ultrafine-grained gold wires

C. C. Wong, H. M. Goh, F. Wulff, 2008 .

Doping-induced simultaneous improvement of strength and ductility in ultrafine grained gold wires

C. C. Wong, C. Breach, F. Wulff, 2006 .

Effects of calcium on the mechanical properties of ultra-fine grained gold wires

C. C. Wong, S. Mhaisalkar, C. Breach, 2006 .

Effects of calcium and palladium on mechanical properties and stored energy of hard-drawn gold bonding wire

Saraswati, C. C. Wong, S. Mhaisalkar, 2004 .

Simultaneous Improvement of Ductility and Strength by Minute Doping in Ultrafine Grained Au Wires-Experiment and First Principle Study

C. C. Wong, C. Ferraris, Y. H. Chew, 2008 .

Effects of Ca on grain boundary cohesion in Au ballbonding wire

Chaobin He, Tingting Lin, C. Wong, 2006 .

A Comparison Study of the Bondability and Reliability Performance of Au Bonding Wires with Different Dopant Levels

H. M. Goh, D. Stephan, E. Theint, 2007, Electronic Packaging Technology Conference.