Takahiko Mitsui

Wafer Handling and Thinning Processes

Toshihiro Ito, E. Yamamoto, T. Haimoto, 2015 .

Metal contamination evaluation of a TSV reveal process using direct Si/Cu grinding and residual metal removal

N. Watanabe, M. Aoyagi, E. Yamamoto, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Investigation of metal contamination induced by a through silicon via reveal process using direct Si/Cu grinding and residual metal removal

N. Watanabe, M. Aoyagi, E. Yamamoto, 2016 .

Induction of inactive TGF-β1 monomer formation by hydrogen sulfide contributes to its suppressive effects on Ang II- and TGF-β1-induced EMT in renal tubular epithelial cells.

N. Sawada, Yong Huang, Y. Huang, 2018, Biochemical and biophysical research communications.

Improvement of a TSV Reveal Process Comprising Direct Si/Cu Grinding and Residual Metal Removal

N. Watanabe, M. Aoyagi, E. Yamamoto, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).