O. S. Chiew

Three chips stacking with low volume solder using single re-flow process

N. Khan, L. Lim, Hong Yu Li, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Evolution of Microstructure and Mechanical Properties of Eutectic Sn-Pb Solder Joint Aged under Thermal Gradient

Zhong Chen, S. Yoon, C.C. Wong, 2007, 2007 9th Electronics Packaging Technology Conference.