Su-Ching Chung

The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

C. Zhan, S. Lu, J. Juang, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Board-level reliability of coreless flip chip package assembled on a printed circuit board

Tao-Chih Chang, C. Zhan, J. Chou, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

John H. Lau, Chau-Jie Zhan, Shin-Yi Huang, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film

Yu-Min Lin, J. Lau, C. Zhan, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles

C. Zhan, Yu-wei Huang, S. Lu, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Utilization of Zn alloy for the manufacture of automotive power device modules

Tao-Chih Chang, K. Kao, Chia-Wen Fan, 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).

Reliability performance of 30μm-pitch solder micro bump fluxless bonding interconnections

Yu-Min Lin, Tao-Chih Chang, Su-Ching Chung, 2018, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).

Development of high throughput adhesive bonding scheme by wafer-level underfill for 3D die-to-interposer stacking with 30µm-pitch micro interconnections

Yu-Min Lin, Tao-Chih Chang, C. Zhan, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

Yu-Min Lin, J. Lau, C. Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Kuo-Shu Kao, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.