Tai-Hung Chen

The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

C. Zhan, S. Lu, J. Juang, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

Yu-Min Lin, J. Lau, C. Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Kuo-Shu Kao, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.