S. Fujiwara

Bondability of Si-Ge thermoelectric element and molybdenum electrode using aluminum for thermoelectric module

Tomotake Tohei, S. Fujiwara, T. Jinushi, 2012, 2012 4th Electronic System-Integration Technology Conference.

Bondability of Mg2Si element to Ni electrode using Al for thermoelectric modules

Tomotake Tohei, S. Fujiwara, T. Jinushi, 2014 .

Ultrasonic bonding of Cu/Ni and its thermal reliability

T. Sano, T. Ogura, A. Hirose, 2015 .

Electromigration failure analysis of flip-chip solder joint by using void growth simulation and synchrotron radiation X-ray microtomography

H. Shintani, H. Tanie, Nobuhiko Chiwata, 2012, 2012 4th Electronic System-Integration Technology Conference.

Void Growth Analysis of Flip-Chip Solder Joint by Using Electromigration Failure Simulation and Synchrotron Radiation X-Ray Microtomography

H. Shintani, H. Tanie, Nobuhiko Chiwata, 2012 .

Microstructure and adhesion mechanism of mechanically prepared composite particles

M. Senna, S. Fujiwara, K. Mizota, 1991 .

Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating

R. Dauskardt, S. Fujiwara, 2012 .

Deterioration mechanism of flip chip attachment using an anisotropic conductive film and design technology for high reliability

S. Fujiwara, M. Harada, M. Harada, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Bondability of Cu wire on Cu substrate with Sn plating by ultrasonic

R. Dauskardt, S. Fujiwara, 2015 .