T. Yuan

Integrated Flow-Thermomechanical Analysis of Solder Joints Fatigue in a Low Air Flow C 4 / CBGA Integrated Flow-Thermomechanical Analysis of Solder Joints Fatigue in a Low Air Flow C 4 / CBGA Package

B. Z. Hong, T. Yuan, 1999 .

Thermal modelling of integrated heat exchangers with alternating ribs

T. Yuan, 1992, [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems.

Integrated flow-thermomechanical and reliability analysis of a low air cooled flip chip-PBGA package

Tsorng-Dih Yuan, Bor Zen Hong, B. Z. Hong, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Integrated flow-thermomechanical analysis of solder joints fatigue in a low air flow C4/CBGA package

B. Zen Hong, T.-D. Yuan, B. Z. Hong, 1998 .

Heat transfer and nonlinear thermal stress analysis of a convective surface mount package

B. Z. Hong, T. Yuan, 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.

Buoyancy effects on laminar impinging jets

J. A. Liburdy, J. Liburdy, T. Wang, 1988 .

Application of a surface renewal model to the prediction of heat transfer in an impinging jet

J. Liburdy, T. Yuan, 1992 .

Recirculating mixed convection flows in rectangular cavities

Ranganathan Kumar, T. Yuan, 1988 .