Huakai Luan

发表

Ping Su, F. Hou, Huakai Luan, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Sanming Hu, F. Hou, Yizhu Shen, 2022, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Sanming Hu, Jian Zhu, F. Hou, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.