M. Sobczak

HIGH THERMO-MECHANICAL FATIGUE AND DROP SHOCK RESISTANT ALLOYS FOR BALL-GRID ARRAY PACKAGE APPLICATIONS

Anilesh Kumar, M. Ribas, P. Choudhury, 2016 .

Wafer level CSP with ultra-high thermal reliability lead-free alloys

Anilesh Kumar, M. Ribas, P. Choudhury, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

The photochemistry of o-benzylbenzophenone: a pericyclic cornucopia

P. Wagner, M. Sobczak, 1998 .

Light-induced decarboxylation of (o-acylphenyl)acetic acids.

P. Wagner, M. Sobczak, 2002, Organic letters.

3D Die-to-wafer Cu/Sn Microconnects Formed Simultaneously with an Adhesive Dielectric Bond Using Thermal Compression Bonding

Zhihong Huang, Robert E. Jones, Scott Pozder, 2008, 2008 International Interconnect Technology Conference.

Advanced thermal interface materials for enhanced flip chip BGA

M. Sobczak, P. Kohli, J. Bowin, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).