L. Yu

Study into grinding force in back grinding of wafer with outer rim

Z. Dong, R. Kang, Shang Gao, 2020, Advances in Manufacturing.

Solder joints design attribute to no solder bridge for fine pitch device

L. Yu, W. Qing, 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..

Effect of hardenability on microstructure and property of low alloy abrasion-resistant steel

Dong Liu, Wenqian Zhang, Yue Wang, 2020 .

Experimental study on the mechanical properties of microbial mixed backfill

Hao Liu, Xuejie Deng, L. Yu, 2020, Construction and Building Materials.

Mixture Ratio Design of Inorganic Polymer Concrete and the Study of Expansive Performance

Z. Lu, L. Yu, X. Yuan, 2013 .

Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices

L. Yu, W. Qing, B. Sur, 2004 .