Lixiang Zhang

Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process

F. Qin, Yanwei Dai, Tong An, 2019, Current Applied Physics.

Research on heat dissipation of RF microsystem 3D packaging based on gold stud bumps and Au-Sn eutectic welding

Hongjiang Wu, Kaixue Ma, Lixiang Zhang, 2022, International Conference on Electronic Packaging Technology.