O. Nousiainen

Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies

O. Nousiainen, L. Lehtiniemi, T. Kangasvieri, 2008, Microelectron. Reliab..

Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications

Olli Salmela, Jyrki Lappalainen, Jussi Putaala, 2014 .

Thermomechanically loaded lead-free LGA joints in LTCC/PWB assemblies

O. Nousiainen, T. Kangasvieri, R. Rautioaho, 2010 .

Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies

H. Jantunen, O. Nousiainen, T. Kangasvieri, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

Failure Detection of BGA Transition Structures at High Frequencies

H. Jantunen, O. Nousiainen, J. Putaala, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly

Jussi Putaala, O. Nousiainen, T. Kangasvieri, 2006 .

Influence of Thermal-Cycling-Induced Failures on the RF Performance of Ceramic Antenna Assemblies

H. Jantunen, O. Nousiainen, T. Kangasvieri, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Development of a reliable LTCC-BGA module platform for RF/microwave telecommunication applications

O. Nousiainen, J. Vähäkangas, Kari Kautio, 2007 .