Yarong Chen
发表
Wei Zhang,
Meng Yang,
Binbin Zhang,
2012
.
Chunqing Wang,
Yanhong Tian,
Yarong Chen,
2005,
2005 6th International Conference on Electronic Packaging Technology.
Effects of Cu Addition on Growth of Au-Sn Intermetallics at Sn-xCu/Au Interface during Aging Process
Chunqing Wang,
Yanhong Tian,
Wei Liu,
2007
.
Effects of Cu Addition on Growth of Au-Sn Intermetallics at Sn-xCu/Au Interface during Aging Process
Chunqing Wang,
Yanhong Tian,
Wei Liu,
2007,
2007 International Symposium on High Density packaging and Microsystem Integration.
Y. Liu,
Hui Chen,
Yarong Chen,
2023,
Coatings.
Meng Yang,
R. An,
Yarong Chen,
2014,
2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.
Meng Yang,
R. An,
Yarong Chen,
2014,
2014 15th International Conference on Electronic Packaging Technology.
Meng Yang,
R. An,
Bin-bin Zhang,
2012
.
Lining Sun,
Chunqing Wang,
Yanhong Tian,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Chunqing Wang,
Yanhong Tian,
Wei Liu,
2008
.
Chunqing Wang,
Yanhong Tian,
Yarong Chen,
2009
.
Y. Liu,
Hui-hua Chen,
Jintao Chen,
2022,
Materials Science and Engineering: A.
Y. Liu,
Hui Chen,
Yarong Chen,
2023,
Surface and Coatings Technology.
Hao Wang,
Haizhou Li,
Zhongtao Sun,
2022,
Materials Characterization.