E. Paleczny

发表

On the analysis of four symmetrical interconnects for signal integrity evaluation

D. Deschacht, F. Ponchel, J.F. Legier, 2005, Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005..

MODE CONVERSION AT DISCONTINUITIES IN A MICROSTRIP COUPLED LINE WAVEGUIDE

E. Paleczny, P. Kennis, Philippe Pannier, 1998 .

Comparison of full wave approaches for determination of microstrip conductor losses for MMIC applications

E. Paleczny, D. Kinowski, P. Kennis, 1990 .

Victim andaggressor line electrical modelisation inanmulticoupled interconnect environment fortransient simulation

D. Deschacht, F. Ponchel, E. Paleczny, 2006 .

Full Wave Analysis and Electrical Modeling of Eight Copper Interconnects Placed in a Giga-Scale Integrated Environment for Signal Integrity Evaluation

D. Deschacht, F. Ponchel, J.F. Legier, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Proximity Effect ofNeighbour Victim Lossy Interconnects onaSingle Attacker andViceVersa

D. Deschacht, F. Ponchel, E. Paleczny, 2012 .

Calibration TRL multimode : Principe, validation expérimentale et perspectives

E. Paleczny, C. Seguinot, P. Kennis, 1997 .

Imperfect Return Path Effects on RLCG Model of Single and Coupled Interconnects: Propagation delay, Rise Time and Crosstalk Prediction

J.F. Legier, E. Paleczny, F. Huret, 2002, Proceedings: 6th IEEE Workshop on Signal Propagation on Interconnects.

Full‐wave analysis of asymmetric CPW–microstrip overlap transitions for MMIC interconnects and packaging

E. Paleczny, P. Kennis, Philippe Pannier, 1997 .

Comparison Between a Full-Wave and a Quasi-Static Analysis for High-Frequency Interconnects Crossover in Multilayered Dielectric Media

E. Paleczny, P. Kennis, J.F Carpentier, 1994, 1994 24th European Microwave Conference.

Parasitic influence, on signal integrity, of several victim lines placed asymmetrically beside and symmetrically at both sides of an attacker interconnect and mutually

D. Deschacht, F. Ponchel, J.F. Legier, 2008, 2008 12th IEEE Workshop on Signal Propagation on Interconnects.

Full‐wave analysis of superconducting microstrip for MMIC applications

E. Paleczny, P. Kennis, J. F. Legier, 1991 .

Analytical and Full-Wave Characterization of Multimode Waveguide Discontinuities

E. Paleczny, C. Seguinot, P. Kennis, 1997, 1997 27th European Microwave Conference.

Inductance effect for interconnection timing analysis in submicronic circuits

G. Servel, D. Deschacht, E. Paleczny, 1999, ICECS'99. Proceedings of ICECS '99. 6th IEEE International Conference on Electronics, Circuits and Systems (Cat. No.99EX357).

Victim and aggressor line electrical modelisation in an multicoupled interconnect environment for transient simulation

D. Deschacht, F. Ponchel, J.F. Legier, 2006, 2006 IEEE Workship on Signal Propagation on Interconnects.

FullWaveAnalysis andElectrical Modeling ofEightCopperInterconnects Placed ina Giga-Scale Integrated Environment forSignal Integrity Evaluation

D. Deschacht, E. Paleczny, C. Seguinot, 2006 .

Theoretical analysis of signal reflections on Cu on-chip interconnections

G. Servel, D. Deschacht, E. Paleczny, 2000 .

Multimode TRL. A new concept in microwave measurements: theory and experimental verification

E. Paleczny, C. Seguinot, P. Kennis, 1998 .

Coupled line modelization of lossy adjacent interconnects with a full wave tangential vector finite element method

G. Servel, D. Deschacht, E. Paleczny, 2001 .

Input Shape Influence over Interconnect Performances

G. Servel, D. Deschacht, E. Paleczny, 2000 .

Full Wave Analysis of Superconducting Microstrip for MMIC Applications

E. Paleczny, P. Kennis, P. Pribetich, 1991, 1991 21st European Microwave Conference.

A full-wave analysis of submicronic circuits in the microwave frequency range to estimate the input shape influence over VLSI interconnect performances

G. Servel, D. Deschacht, E. Paleczny, 1999 .

Inductive effects on crosstalk evaluation

G. Servel, D. Deschacht, E. Paleczny, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Electrical performance of single and coupled Cu interconnects for the 70 nm technology

D. Deschacht, E. Paleczny, C. Seguinot, 2004, Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.

Inductance effect in interconnect coupling noise

D. Deschacht, E. Paleczny, Fabrice Huret, 2001 .

Experimental determination of the characteristic impedance matrix of multiconductor quasi‐TEM lines

E. Paleczny, C. Seguinot, P. Kennis, 1999 .

1 to 220 GHz Complex Permittivity Behavior of Flexible Polydimethylsiloxane Substrate

E. Paleczny, T. Lasri, L. Dubois, 2014, IEEE Microwave and Wireless Components Letters.