F. Jourdan

Copper-SilK integration in a 0.18 /spl mu/m double level metal interconnect

Yves Morand, Christian Arvet, T. Mourier, 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247).

Formation of 2-D arrays of semiconductor nanocrystals or semiconductor-rich nanolayers by very low-energy Si or Ge ion implantation in silicon oxide films

J. Gautier, J. Berg, C. Vieu, 2001 .

Copper-SiOC-AirGap integration in a double level metal interconnect

Y. Morand, M. Assous, L. Ulmer, 2000, Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).