Takayuki Kai

Isolation Techniques Against Substrate Noise Coupling Utilizing Through Silicon Via (TSV) Process for RF/Mixed-Signal SoCs

Shiro Dosho, Shinichiro Uemura, Yukio Hiraoka, 2012, IEEE Journal of Solid-State Circuits.

MARIO: Mid-air Augmented Reality Interaction with Objects

Takeshi Naemura, Hiroki Yamamoto, Satoshi Maekawa, 2013, Entertain. Comput..