Leida Chen

Effect of surface finish (OSP and ENEPIG) on failure mechanism induced by electromigration in Sn-3.0Ag-0.5Cu flip chip solder interconnect

Mingliang L. Huang, Leida Chen, Shaoming Zhou, 2011, 2011 International Symposium on Advanced Packaging Materials (APM).

An investigation on hydrogen storage kinetics of nanocrystalline and amorphous Mg2Ni1−xCox (x = 0–0.4) alloy prepared by melt spinning

H. Ren, X. Ding, Yang-huan Zhang, 2011 .

Hydrogen Storage Kinetics of Mg20Ni10-xMx (M=Cu, Co; x=0-4) Alloys Prepared by Melt Spinning

Yang-huan Zhang, Dong-liang Zhao, Guofang Zhang, 2011 .

Enhanced Electrochemical Cycle Stability of RE-Mg-Ni System A2B7-Type Alloys by Melt Spinning and Substituting La with Pr

Yang-huan Zhang, Bao-wei Li, Leida Chen, 2011 .

An Investigation on the Electrochemical Cycle Stability of La0.75−xZrxMg0.25Ni3.2Co0.2Al0.1 (x = 0-0.2) Alloys Prepared by Melt Spinning

Y. Cai, Yang-huan Zhang, Dong-liang Zhao, 2011 .

Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect

Mingliang L. Huang, Leida Chen, Shaoming Zhou, 2010 .

Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects

Leida Chen, Shaoming Zhou, L. D. Chen, 2012, Journal of Electronic Materials.

Effect of electromigration on interfacial reaction of Cu/Sn3.0Ag0.5Cu/Ni solder joint at high temperature

Mingliang L. Huang, Yuming Ye, Leida Chen, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Effects of temperature and current density on (Au, Pd, Ni)Sn4 redistribution and Ni-P consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joints

Mingliang L. Huang, Leida Chen, Xiaoyan Liu, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Stress relaxation and failure behavior of Sn–3.0Ag–0.5Cu flip-chip solder bumps undergoing electromigration

Mingliang L. Huang, Zhijie Zhang, Leida Chen, 2014 .