Yuejin Guo

Flip-Chip Technology on Organic Pin Grid Array Packages

Mirng-Ji Lii, Hwai Peng Yeoh, M. Lii, 2000 .

Electronic Structure and Valence-Bond Band Structure of Cuprate Superconducting Materials

W. Goddard, J. Langlois, Yuejin Guo, 1988, Science.

Is carbon nitride harder than diamond? No, but its girth increases when stretched (negative Poisson ratio)

W. Goddard, Yuejin Guo, 1995 .

Theoretical studies of pentene cracking on zeolites: C-C β-scission processes

P. Hay, A. Redondo, Yuejin Guo, 1999 .

Thermal Modeling of GaN HEMT Devices With Diamond Heat-Spreader

Hongyu Yu, Yuejin Guo, M. Mahrokh, 2020, IEEE Journal of the Electron Devices Society.

Pressureless In-air Sintered Silver Bonding Bare Silicon Die on Silver-metallized Heat Spreader

Dong Liu, Yuejin Guo, Chengxin Zhang, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).