F. Kuechenmeister
发表
Frank Kuechenmeister,
Michael Su,
Lei Fu,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Dirk Breuer,
Jens Paul,
Jae Kyu Cho,
2018,
2018 International Wafer Level Packaging Conference (IWLPC).
S. Kannan,
Shan Gao,
R. S. Smith,
2015
.
J. Chin,
X. Zhao,
Michael Su,
2009,
2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.
C. Papadopoulos,
J. Prinz,
A. Rodríguez,
2020
.
Dirk Breuer,
Jae Kyu Cho,
Frank Kuechenmeister,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
F. X. Che,
Jong-Kai Lin,
K. Y. Au,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Dirk Breuer,
Jens Paul,
Frank Kuechenmeister,
2020,
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Dirk Breuer,
Jens Paul,
Frank Kuechenmeister,
2015,
2015 IEEE International Reliability Physics Symposium.
P. Hofmann,
F. Kuechenmeister,
D. Breuer,
2013,
2013 IEEE International Reliability Physics Symposium (IRPS).
Chirag Shah,
Dirk Breuer,
Shan Gao,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
F. Kuechenmeister,
Christian Goetze,
S. Capecchi,
2019,
European Microelectronics and Packaging Conference.