Seungman Choi

Chip package interaction analysis for 20-nm technology with thermo-compression bonding with non-conductive paste

S. Kannan, Shan Gao, R. S. Smith, 2015, Electronic Components and Technology Conference.

Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond

S. Kannan, Shan Gao, R. S. Smith, 2015 .

Nickel Silicide Electromigration on Micro Ring Modulators for Silicon Photonics Technology

M. Rakowski, B. McGowan, Seungman Choi, 2023, IEEE International Reliability Physics Symposium.

Compensation of laser propagation effects within solids for high harmonic generation of extreme ultraviolet radiation

Young‐Jin Kim, Seung-Woo Kim, Hyunwoong Kim, 2022, Optics & Laser Technology.

Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal

K. Nummy, D. Moy, N. Robson, 2023, Optical Fiber Communications Conference and Exhibition.