J. Shin

Chip package interaction analysis for 20-nm technology with thermo-compression bonding with non-conductive paste

S. Kannan, Shan Gao, R. S. Smith, 2015, Electronic Components and Technology Conference.

A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages

Seung Mo Kim, Wei Lin, Jin Young Kim, 2005, IEEE Transactions on Electronics Packaging Manufacturing.