H. Reichl
发表
M. Schinkel,
S. Guttowski,
W. John,
2005,
2005 IEEE 36th Power Electronics Specialists Conference.
H. Reichl,
K. Schischke,
A. Middendorf,
2005,
Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005..
Frank Ansorge,
H. Reichl,
K.-F. Becker,
2001
.
S. Guttowski,
H. Reichl,
M. Baba,
2007,
2007 9th Electronics Packaging Technology Conference.
H. Reichl,
S. Karaszkiewicz,
D. Manessis,
2009,
2009 European Microelectronics and Packaging Conference.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2007,
2007 8th International Conference on Electronic Packaging Technology.
H. Reichl,
R. Schacht,
B. Wunderle,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
H. Reichl,
1994,
Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.
H. Reichl,
O. Ehrmann,
K. Zoschke,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
S. Guttowski,
H. Reichl,
S.-P. Weber,
2006,
Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06..
C. P. Wong,
H. Reichl,
Jianmin Qu,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
H. Reichl,
S. Karaszkiewicz,
D. Manessis,
2008,
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
S. Guttowski,
H. Reichl,
M. Niedermayer,
2006,
2006 5th International Conference on Information Processing in Sensor Networks.
S. Guttowski,
W. John,
H. Reichl,
2005,
2005 IEEE 36th Power Electronics Specialists Conference.
S. Guttowski,
H. Reichl,
D.D. Polityko,
2005,
28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005..
H. Reichl,
A. Ostmann,
T. Loher,
2008,
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
H. Reichl,
A. Andreini,
M.I. Natarajan,
2003,
2003 Electrical Overstress/Electrostatic Discharge Symposium.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2004,
4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004..
S. Guttowski,
H. Reichl,
I. Ndip,
2006,
2006 Ph.D. Research in Microelectronics and Electronics.
H. Reichl,
G. Fotheringham,
1992,
CompEuro 1992 Proceedings Computer Systems and Software Engineering.
H. Reichl,
T. Braun,
K.-F. Becker,
2009,
2009 59th Electronic Components and Technology Conference.
Frank Ansorge,
H. Reichl,
Bernd Michel,
2001
.
H. Reichl,
R. Aschenbrenner,
C. Kallmayer,
2009,
2009 11th Electronics Packaging Technology Conference.
H. Reichl,
Components,
1992
.
H. Reichl,
H. Griese,
O. Deubzer,
2005,
2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing.
H. Reichl,
V. Grosser,
M. Schuenemann,
1999,
MHS'99. Proceedings of 1999 International Symposium on Micromechatronics and Human Science (Cat. No.99TH8478).
S. Guttowski,
H. Reichl,
I. Ndip,
2008,
2008 2nd Electronics System-Integration Technology Conference.
H. Reichl,
A. Middendorf,
T. Eckert,
2008,
2008 2nd Electronics System-Integration Technology Conference.
H. Reichl,
R. Aschenbrenner,
K.-F. Becker,
2007,
2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.
C. Landesberger,
H. Reichl,
A. Ostmann,
2001
.
H. Reichl,
A. Simsek,
W. Strohschein,
1999
.
H. Reichl,
A. Ostmann,
T. Loher,
2008,
2008 IEEE 9th VLSI Packaging Workshop of Japan.
H. Reichl,
O. Ehrmann,
M. Topper,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
H. Reichl,
G. Sommer,
I. Doerr,
2004,
Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.
H. Reichl,
G. Sommer,
W. John,
2004,
Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.
H. Reichl,
A. Stevels,
H. Griese,
2005,
Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC..
M. Schinkel,
S. Guttowski,
H. Reichl,
2006,
Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06..
S. Guttowski,
W. John,
H. Reichl,
2004,
2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551).
H. Reichl,
R. Jordan,
O. Ehrmann,
2006,
56th Electronic Components and Technology Conference 2006.
H. Reichl,
V. Glaw,
P. Kersten,
1993
.
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2006,
2006 International Microsystems, Package, Assembly Conference Taiwan.
H. Reichl,
M.J. Wolf,
2006,
2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.
W. John,
H. Reichl,
I. Ndip,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
S. Guttowski,
W. John,
H. Reichl,
2003,
2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03..
S. Guttowski,
H. Reichl,
I. Ndip,
2012,
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
W. John,
H. Reichl,
J. Willemen,
2003,
2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03..
S. Guttowski,
W. John,
H. Reichl,
2004,
2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559).
S. Guttowski,
H. Reichl,
I. Ndip,
2008,
2008 Electrical Design of Advanced Packaging and Systems Symposium.
W. John,
H. Reichl,
K.-F. Becker,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
H. Reichl,
R. Aschenbrenner,
Joachim Kloeser,
2000
.
H. Reichl,
A. Middendorf,
H. Griese,
2004,
2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of.
S. Guttowski,
H. Reichl,
D.D. Polityko,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
H. Reichl,
K. Schischke,
L. Stobbe,
2008,
2008 IEEE International Symposium on Electronics and the Environment.
H. Reichl,
K. Schischke,
H. Griese,
2003,
2003 EcoDesign 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing.
H. Reichl,
A. Thiede,
I. Ndip,
2005,
Research in Microelectronics and Electronics, 2005 PhD.
H. Reichl,
O. Ehrmann,
B. Wunderle,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
S. Guttowski,
H. Reichl,
I. Ndip,
2007,
2007 IEEE International Symposium on Electromagnetic Compatibility.
H. Reichl,
A. Ostmann,
T. Loher,
2008,
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
S. Guttowski,
H. Reichl,
K.-D Lang,
2011,
IEEE Transactions on Electromagnetic Compatibility.
S. Guttowski,
H. Reichl,
I. Ndip,
2008,
2008 Electrical Design of Advanced Packaging and Systems Symposium.
H. Reichl,
K. Schischke,
H. Griese,
2004,
2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of.
H. Reichl,
M. Schneider-Ramelow,
U. Geissler,
2009,
IEEE Transactions on Components and Packaging Technologies.
H. Reichl,
R. Schacht,
B. Wunderle,
2007,
2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).
H. Reichl,
H. Griese,
I. Stobbe,
2004,
2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2004,
IEEE Transactions on Advanced Packaging.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2003
.
H. Reichl,
H. Reichl,
1993,
Proceedings of IEEE Systems Man and Cybernetics Conference - SMC.
H. Reichl,
R. Leutenbauer,
V. Grosser,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
H. Reichl,
K. Schischke,
H. Griese,
2004,
IEEE International Symposium on Electronics and the Environment, 2004. Conference Record. 2004.
H. Reichl,
A. Middendorf,
H. Griese,
2003,
2003 EcoDesign 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing.
W. John,
H. Reichl,
I. Ndip,
2005,
2005 7th Electronic Packaging Technology Conference.
H. Reichl,
J. Wolf,
V. Grosser,
2005,
2005 7th Electronic Packaging Technology Conference.
S. Guttowski,
H. Reichl,
I. Ndip,
2007,
2007 9th Electronics Packaging Technology Conference.
M. Stecher,
G. Groos,
H. Reichl,
2005,
Research in Microelectronics and Electronics, 2005 PhD.
Oswin Ehrmann,
H. Reichl,
Christof Landesberger,
2000
.
H. Reichl,
R. Aschenbrenner,
M. Klein,
1998
.
H. Reichl,
A. Middendorf,
H. Griese,
2003,
2003 EcoDesign 3rd International Symposium on Environmentally Conscious Design and Inverse Manufacturing.
S. Guttowski,
H. Reichl,
D.D. Polityko,
2006,
56th Electronic Components and Technology Conference 2006.
H. Reichl,
A. Pahl,
A. Ostmann,
2005,
2005 6th International Conference on Electronic Packaging Technology.
H. Reichl,
A. Ostmann,
T. Loher,
2009,
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
M. Schinkel,
S. Guttowski,
W. John,
2006,
Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06..
W. John,
H. Reichl,
A.E. Engin,
2006,
IEEE Transactions on Advanced Packaging.
H. Reichl,
R. Leutenbauer,
V. Grosser,
1998,
Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176.
H. Reichl,
A. Simsek,
1998,
IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370).
H. Reichl,
A. Middendorf,
H. Griese,
2005,
2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing.
W. John,
H. Reichl,
I.N. Ndip,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
H. Reichl,
P. Ramm,
A. Klumpp,
2008,
2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
S. Guttowski,
H. Reichl,
D.D. Polityko,
2007,
2007 9th Electronics Packaging Technology Conference.
Andreas Ostmann,
H. Reichl,
Joachim Kloeser,
1999
.
H. Reichl,
G. Sommer,
W. John,
2004,
Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.
W. John,
H. Reichl,
I. Ndip,
2005,
2005 European Microwave Conference.
H. Reichl,
H. Griese,
U.C. Pandey,
2004,
2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of.
H. Reichl,
K. Schischke,
H. Griese,
2004,
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).
H. Reichl,
O. Ehrmann,
K. Kaletta,
2007,
IEEE Transactions on Advanced Packaging.
H. Reichl,
1989,
Proceedings. VLSI and Computer Peripherals. COMPEURO 89.
H. Reichl,
O. Ehrmann,
K. Zoschke,
2009,
2009 11th Electronics Packaging Technology Conference.
H. Reichl,
B. Michel,
A. Schubert,
1997,
Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.
H. Reichl,
R. Schacht,
B. Wunderle,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
H. Reichl,
D. Metzger,
H. Reichl,
1990
.
H. Reichl,
U. Drechsler,
B. Wunderle,
2011,
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
S. Guttowski,
H. Reichl,
E. Hoene,
2003,
2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03..
H. Reichl,
Components,
H. Reichl,
1990
.
H. Reichl,
R. Hahn,
H. Reichl,
2006,
56th Electronic Components and Technology Conference 2006.
S. Guttowski,
H. Reichl,
I. Ndip,
2008,
2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility.
H. Reichl,
Paul Kasulke,
V. Bader,
1997,
1997 Proceedings 47th Electronic Components and Technology Conference.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2006,
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
H. Reichl,
P. Russer,
T. Mangold,
1998,
1998 URSI International Symposium on Signals, Systems, and Electronics. Conference Proceedings (Cat. No.98EX167).
H. Reichl,
I. Ndip,
B. Curran,
2008,
2008 Electrical Design of Advanced Packaging and Systems Symposium.
H. Reichl,
J. Haberland,
S. Cichos,
2002,
2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599).
H. Reichl,
E. Zakel,
S. Weiss,
1994,
1994 Proceedings. 44th Electronic Components and Technology Conference.
H. Reichl,
T. Braun,
M. Schneider-Ramelow,
2007,
2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2009,
2009 11th Electronics Packaging Technology Conference.
H. Reichl,
O. Ehrmann,
K. Zoschke,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
H. Reichl,
M. Hutter,
B. Bramer,
2008,
2008 58th Electronic Components and Technology Conference.
H. Reichl,
R. Aschenbrenner,
G. Elger,
2002
.
C.P. Wong,
H. Reichl,
R. Leutenbauer,
1999,
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).
H. Reichl,
D. Manessis,
A. Ostmann,
2007,
2007 9th Electronics Packaging Technology Conference.
H. Reichl,
B. Wunderle,
B. Michel,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
H. Reichl,
D. Manessis,
A. Ostmann,
2006,
2006 International Microsystems, Package, Assembly Conference Taiwan.
H. Reichl,
R. Aschenbrenner,
D. Manessis,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
H. Reichl,
O. Ehrmann,
M. Toepper,
2006,
56th Electronic Components and Technology Conference 2006.
Oswin Ehrmann,
H. Reichl,
Kyung-Wook Paik,
2003
.
H. Reichl,
Bernd Michel,
Bernhard Wunderle,
2009
.
H. Reichl,
R. Schacht,
B. Wunderle,
2006
.
H. Reichl,
H. Schroder,
L. Brusberg,
2009,
2009 11th Electronics Packaging Technology Conference.
H. Reichl,
M. Schneider-Ramelow,
M. Schneider-Ramelow,
2009
.
H. Reichl,
P. Kersten,
1993
.
H. Reichl,
M. Schneider-Ramelow,
K.D. Lang,
2006,
2006 1st Electronic Systemintegration Technology Conference.
H. Reichl,
R. Leutenbauer,
E. Zakel,
1991,
1991 Proceedings 41st Electronic Components & Technology Conference.
Andreas Ostmann,
H. Reichl,
E. Jung,
2002,
2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599).
H. Reichl,
F. Solzbacher,
T. Braun,
2006,
56th Electronic Components and Technology Conference 2006.
H. Reichl,
E. Zakel,
1990
.
H. Reichl,
B. Wunderle,
B. Michel,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
H. Reichl,
M. Topper,
K. Scherpinski,
2006,
56th Electronic Components and Technology Conference 2006.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
IEEE Transactions on Electronics Packaging Manufacturing.
H. Reichl,
M. Schneider-Ramelow,
K.-F. Becker,
2009
.
H. Reichl,
B. Wunderle,
J. Auersperg,
2008
.
J. Vanfleteren,
H. Reichl,
D. Manessis,
2006,
2006 8th Electronics Packaging Technology Conference.
H. Reichl,
R. Schacht,
B. Wunderle,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
H. Reichl,
K.-F. Becker,
B. Wunderle,
2010,
3rd Electronics System Integration Technology Conference ESTC.
H. Reichl,
P. Ramm,
B. Wunderle,
2008,
2008 58th Electronic Components and Technology Conference.
H. Reichl,
H. Reichl,
R. Hahn,
2006,
19th IEEE International Conference on Micro Electro Mechanical Systems.
H. Reichl,
J. Bauer,
B. Wunderle,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
H. Reichl,
K.-F. Becker,
B. Wunderle,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
H. Reichl,
H. Reichl,
R. Hahn,
2003,
Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003..
H. Reichl,
Jin Yu,
O. Ehrmann,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
H. Reichl,
S. Rzepka,
E. Meusel,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
H. Reichl,
K. Schischke,
J. Mueller,
2006,
Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006..
H. Reichl,
T. Braun,
B. Wunderle,
2008
.
H. Reichl,
M. Topper,
A. Achen,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
H. Reichl,
R. Aschenbrenner,
S. Anhock,
1998,
Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204).
H. Reichl,
H. Bernt,
H. Reichl,
1977
.
H. Reichl,
U. Drechsler,
B. Wunderle,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
H. Reichl,
I. Ndip,
B. Curran,
2008,
2008 10th Electronics Packaging Technology Conference.
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
Microtechnology For Realization Of Dielectrophoresis Enhanced Microwells For Biomedical Applications
R. Guerrieri,
H. Reichl,
J. Bauer,
2007,
2007 9th Electronics Packaging Technology Conference.
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
H. Reichl,
G. Engelmann,
J. Wolf,
1998
.
S. Guttowski,
H. Reichl,
S. Dieckerhoff,
2007,
2007 European Conference on Power Electronics and Applications.
H. Reichl,
B. Michel,
N. Sabate,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
H. Reichl,
M. Hutter,
L. Dietrich,
2006,
56th Electronic Components and Technology Conference 2006.
Development of a design library for embedded passive RF components in HDI organic substrate material
H. Reichl,
R. Lempkowski,
G. Sommer,
2003,
2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03..
H. Reichl,
R. Aschenbrenner,
Christine Kallmayer,
1998,
1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
H. Reichl,
O. Ehrmann,
M. Topper,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
H. Reichl,
R. Aschenbrenner,
B. Pahl,
2005,
2005 7th Electronic Packaging Technology Conference.
H. Reichl,
W. Mathis,
G. Sommer,
2004,
Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.
H. Reichl,
L. Boettcher,
D. Manessis,
2006
.
H. Reichl,
M. Kruger,
T. Eckert,
2009,
2009 11th Electronics Packaging Technology Conference.
H. Reichl,
R. Schacht,
B. Wunderle,
2010,
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Andreas Ostmann,
H. Reichl,
Elke Zakel,
1997,
1997 Proceedings 47th Electronic Components and Technology Conference.
H. Reichl,
T. Braun,
B. Wunderle,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
H. Reichl,
B. Michel,
O. Wittler,
2001,
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).
H. Reichl,
O. Wittler,
R. Muller-Fiedler,
2010,
3rd Electronics System Integration Technology Conference ESTC.
H. Reichl,
R. Schacht,
B. Wunderle,
2008,
2008 2nd Electronics System-Integration Technology Conference.
H. Reichl,
O. Ehrmann,
M. Topper,
2006,
56th Electronic Components and Technology Conference 2006.
H. Reichl,
O. Ehrmann,
B. Wunderle,
2008,
2008 58th Electronic Components and Technology Conference.
H. Reichl,
R. Aschenbrenner,
J. Kloeser,
1995,
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.
S. Guttowski,
H. Reichl,
I. Ndip,
2008,
2008 38th European Microwave Conference.
H. Reichl,
Sabine Nieland,
Young-Doo Jeon,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).