D. Shangguan

Predicted Thermal Stresses in a Trimaterial Assembly With Application to Silicon-Based Photovoltaic Module

E. Suhir, L. Béchou, D. Shangguan, 2013 .

Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections

D. Shangguan, Jin Liang, N. Dariavach, 2007 .

Metallurgy and Kinetics of Liquid-Solid Interfacial Reaction during Lead-Free Soldering

Dongkai Shangguan, Jin Liang, Nader G. Dariavach, 2006 .

Indentation Induced Tin Whisker Formation on Tin Plated Component Leads

Xiaodong Li, Zhihui Xu, D. Shangguan, 2005 .