C. Wei

发表

Effect of anisotropy in thermal conductivity on grain boundary migration under temperature gradient – A phase field study

C. Ke, S. Liang, C. Wei, 2021 .

Insight into the preferential grain growth of intermetallics under electric current stressing – A phase field modeling

C. Ke, S. Liang, Anil Kunwar, 2021 .

Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress

C. Ke, S. Liang, Xin-Ping Zhang, 2019, Journal of Materials Research.

Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient

C. Ke, S. Liang, Xin-Ping Zhang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Three-Dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure

W. Le, C. Ke, S. Liang, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Three-dimensional Simulation of Effects of Electro-Thermo-Mechanical Multi-physical Fields on Cu Protrusion and Performance of Micro-bump Joints in TSVs Based High Bandwidth Memory (HBM) Structures

C. Ke, Zheng Wang, Xin-Ping Zhang, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via

C. Ke, S. Liang, S. Cao, 2022, IEEE transactions on device and materials reliability.

Phase field modelling combined with data-driven approach to unravel the orientation in...uenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing

C. Ke, Haoran Ma, Anil Kunwar, 2023, Surfaces and Interfaces.

Phase field modelling of the electromigration behaviour in sintered silver

C. Ke, S. Liang, Hanqing Jiang, 2022, Journal of Materials Research.

An improved phase field method by using statistical learning theory-based optimization algorithm for simulation of martensitic transformation in NiTi alloy

C. Ke, C. Wei, S. Liang, 2020 .

Study of migration and coalescence of voids driven by electric current stressing in solder interconnects using phase field simulation

C. Ke, S. Liang, X.P. Zhang, 2022, Microelectronics Reliability.