Tai-Hong Chen

发表

Reliability estimation and failure mode prediction for 3D chip stacking package with the application of wafer-level underfill

K. Kao, Chang-Chun Lee, Tsung-Fu Yang, 2013 .

Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film

C. Zhan, K. Kao, Chang-Chun Lee, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Evaluation of Cu/Ni/SnAg microbump bonding processes for thin-chip-on-chip package using a wafer-level underfill film

C. Zhan, K. Kao, Chang-Chun Lee, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Barrier property and mechanical flexibility of stress controlled organosilicon/silicon oxide coatings on plastic substrates

L. Lai, Shaoning Lu, Day-Shan Liu, 2015 .

The achievement of a zinc oxide-based homojunction diode using radio frequency magnetron cosputtering system

Ching-Ting Lee, L. Lai, Day-Shan Liu, 2015 .

Impact on the Gas Barrier Property of Silicon Oxide Films Prepared by Tetramethylsilane-Based PECVD Incorporating with Ammonia

Shaoning Lu, Day-Shan Liu, Hua-wen Liu, 2017 .

Processing characteristics and reliability of embedded DDR2 memory chips

Tao-Chih Chang, Chao-Kai Hsu, Yin-Po Hung, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

Characterization of an Amorphous Titanium Oxide Film Deposited onto a Nano-Textured Fluorination Surface

Day-Shan Liu, Hua-wen Liu, Tai-Hong Chen, 2016, Materials.

Enhancement on photocatalytic activity of an amorphous titanium oxide film with nano-textured surface by selective-fluorination etching process

L. Lai, Day-Shan Liu, Tai-Hong Chen, 2014 .

Preparation and Characterization of Surface Photocatalytic Activity with NiO/TiO2 Nanocomposite Structure

L. Lai, Day-Shan Liu, Hua-wen Liu, 2015, Materials.

Effect of Silver Dopants on the ZnO Thin Films Prepared by a Radio Frequency Magnetron Co-Sputtering System

Ching-Ting Lee, Day-Shan Liu, Wei-Hua Hsiao, 2017, Materials.

Surface modification on the sputtering-deposited ZnO layer for ZnO-based schottky diode

L. Lai, Tsung-Hsin Lee, Day-Shan Liu, 2013 .

Defect Structure and EPR Parameters of the Cu2+Center in MNB Ternary Glasses

Ying Wu, W. Feng, Y. Nie, 2008 .

The local structure of SrLaGaO4:Cr3+ crystal

T. Zeng, Yi Huang, Shifu Zhu, 2008 .

Investigation of the EPR Parameters and Defect Structure of Ni2+ Ions in RbMgF3 Crystals

W. Feng, Tai-Hong Chen, Jin-ping Zhang, 2007 .

Theoretical Study of Local Structure for Cr3+ Ions in CsCl Crystal

P. Xu, T. Zeng, Chaoen Huang, 2012 .

Theoretical investigations of the electron paramagnetic resonance for Cr3+ ions at tetragonal sites in K2ZnF4 crystal

G. Liao, T. Zeng, Tai-Hong Chen, 2010 .

High Performance Multilayered Organosilicon/Silicon Oxynitride Water Barrier Structure Consecutively Deposited by Plasma-Enhanced Chemical Vapor Deposition at a Low-Temperature

Shaoning Lu, Day-Shan Liu, Tai-Hong Chen, 2019, Coatings.

Characteristic study of anisotropic-conductive film for chip-on-film packaging

Tai-Hong Chen, Ching-Yun Chang, Shyh-Ming Chang, 2001, Microelectron. Reliab..

A quality photocatalytic activity of an amorphous titanium oxide film achieved using the selectively photochemical etching and its application for the organic light emitting diode encapsulation

L. Lai, Day-Shan Liu, Tai-Hong Chen, 2015 .

Study on flip chip assembly of high density micro-LED array

Ming-Hsien Wu, W. Yeh, Yu-wei Huang, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

High-pressure phase transitions of Mg2Ge and Mg2Sn: First-principles calculations

Tai-Hong Chen, Jiuxun Sun, F. Yu, 2011 .

Enhancement on the Surface Hydrophobicity and Oleophobicity of an Organosilicon Film by Conformity Deposition and Surface Fluorination Etching

Tsung-Hsin Lee, Day-Shan Liu, Tai-Hong Chen, 2018, Materials.

Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Kuo-Shu Kao, Tai-Hong Chen, John H. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch

Yu-Min Lin, Wen-Hwa Chen, S. Lu, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Ren-Shin Cheng, Tai-Hong Chen, John H. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Reliability of 20µm pitch NCF type COF package with compliant-bump

Yu-Min Lin, S. Lu, Tai-Hong Chen, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

Application of numerical analysis to the reliability assessment of a novel package on package (PoP) structure for memory stacking

Tao-Chih Chang, K. Kao, Yin-Po Hung, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

Investigations on the Cosputtered ITO-ZnO Transparent Electrode Ohmic Contacts to n-GaN

Ching-Ting Lee, L. Lai, Day-Shan Liu, 2016 .

Reliability Study of the Band Gap of Rare Earth Oxides Measured by XPS Spectra

Jian Jun Wang, Z. Fang, Yongsheng Tan, 2013 .

Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding

Kuo-Shu Kao, Yin-Po Hung, Ren-Shin Cheng, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking

Tai-Hong Chen, Hsien-Chie Cheng, Su-Tsai Lu, 2012, IEEE Transactions on Device and Materials Reliability.

Development of 30 μm pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip (COC) interconnects

C. Zhan, J. Juang, Chia-Wen Fan, 2010, Impact.