Jungwan Cho

发表

S. Baik, Dongwoo Lee, Agha Aamir Jan, 2021, Materials horizons.

M. Asheghi, K. Goodson, D. Agonafer, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

M. Asheghi, K. Goodson, D. Francis, 2014, 2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

M. Asheghi, K. Goodson, D. Francis, 2017 .

M. Asheghi, K. Goodson, A. Sood, 2017, ACS applied materials & interfaces.

C. McGray, M. Asheghi, K. Goodson, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

M. Asheghi, K. Goodson, A. Sood, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Yiyang Li, M. Asheghi, K. Goodson, 2012, 2012 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

S. I. Park, Hyoungsoon Lee, Jungwan Cho, 2022, International Journal of Heat and Mass Transfer.

K. Goodson, Jungwan Cho, 2015, Nature materials.

Ethan C. Ahn, M. Asheghi, K. Goodson, 2017, Scientific Reports.

Yiyang Li, Kenneth E. Goodson, Mehdi Asheghi, 2014 .

M. Asheghi, Jungwan Cho, M. Asheghi, 2012, IEEE Electron Device Letters.

M. Asheghi, Jungwan Cho, M. Asheghi, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

M. Asheghi, Jungwan Cho, M. Asheghi, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Hyoungsoon Lee, Jungwan Cho, Jihyun Kim, 2019, Solid State Communications.

Thomas L. Bougher, D. Twitchen, M. Asheghi, 2016, 2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

M. Asheghi, K. Goodson, P. Chao, 2013 .

Kenneth E. Goodson, Mehdi Asheghi, Jungwan Cho, 2013, 2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

Ronald K. Hanson, David F. Davidson, Jungwan Cho, 2011 .

D. Twitchen, C. McGray, K. Goodson, 2021, 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).

Bong Jae Lee, S. I. Park, Taeyoung Kim, 2023, International Communications in Heat and Mass Transfer.

Bong Jae Lee, Mikyung Lim, Jungwan Cho, 2022, Physical review letters.