S. Twerefour

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

J. Lau, Y. Pao, S. Erasmus, 1994 .

Reliability of 0.4 mm pitch, 256-pin plastic quad flat pack no-clean and water-clean solder joints

J. Lau, Y. Pao, D. Gilbert, 1993, Electronic Components and Technology Conference.