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J. Lau, Y. Pao, S. Erasmus, 1994 .

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J. Lau, Y. Pao, S. Erasmus, 1992, Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium.

No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)

J. Lau, J. Lau, Y. Pao, 1992 .

Reliability of 0.4 mm pitch, 256-pin plastic quad flat pack no-clean and water-clean solder joints

J. Lau, Y. Pao, D. Gilbert, 1993, Electronic Components and Technology Conference.