Boil Kim

发表

Sohee Kim, Hanseop Choe, Y. Kang, 2020, Advanced Materials Interfaces.

Sang Hyun Park, Sohee Kim, Maan-Gee Lee, 2021, Journal of neural engineering.

Hanseop Choe, Duhee Kim, Hongki Kang, 2023, 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS).