Hemanth Kumar Cheemalamarri

Effect of ultrathin palladium layer in achieving a low temperature and pressure wafer level aluminum to aluminum bonding

S. Singh, S. Vanjari, Hemanth Kumar Cheemalamarri, 2020, Surface Topography: Metrology and Properties.

Interface Analysis of High Reliable Hermitic Sealed Microfluidic Channels for Thermal Cooling in 3D ICs

S. Singh, S. Vanjari, Hemanth Kumar Cheemalamarri, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

Diffusion Enhanced Optimized Thin Passivation Layer for Realizing Copper to Copper Wafer Bonding at Low Thermal Budget

S. Singh, S. Vanjari, Hemanth Kumar Cheemalamarri, 2022, 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression Bonding

S. Singh, S. Vanjari, A. Panigrahi, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).