Satish Bonam
发表
S. Singh,
S. Vanjari,
Hemanth Kumar Cheemalamarri,
2020,
Surface Topography: Metrology and Properties.
S. Singh,
S. Vanjari,
A. Panigrahi,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
S. Singh,
S. Vanjari,
Satish Bonam,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
S. Singh,
Siva Rama Krishna Vanjari,
S. Mohanty,
2022,
Materials Today Sustainability.
J. Joseph,
S. Singh,
S. Vanjari,
2022,
IEEE Transactions on Semiconductor Manufacturing.
Siva Rama Krishna Vanjari,
Asisa Kumar Panigrahi,
Satish Bonam,
2016
.
S. Singh,
S. Vanjari,
Hemanth Kumar Cheemalamarri,
2019,
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
S. Singh,
Satish Bonam,
Atul Suresh Deshpande,
2022,
IEEE Electron Device Letters.
S. Singh,
A. Deshpande,
Satish Bonam,
2023,
Materials Chemistry and Physics.
S. Singh,
S. Vanjari,
Satish Bonam,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
S. Singh,
S. Vanjari,
Hemanth Kumar Cheemalamarri,
2022,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
S. Singh,
S. Vanjari,
A. Panigrahi,
2018
.
Tamal Ghosh,
Shiv Govind Singh,
Siva Rama Krishna Vanjari,
2015,
2015 International 3D Systems Integration Conference (3DIC).
S. Singh,
Satish Bonam,
Venkata Ramesh Naganaboina,
2023,
2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS).
S. Singh,
S. Vanjari,
Satish Bonam,
2019,
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
S. Singh,
S. Vanjari,
A. Panigrahi,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Tamal Ghosh,
Shiv Govind Singh,
Siva Rama Krishna Vanjari,
2016,
2016 IEEE International 3D Systems Integration Conference (3DIC).
Siva Rama Krishna Vanjari,
Asisa Kumar Panigrahi,
Satish Bonam,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
S. Singh,
S. Vanjari,
A. Panigrahi,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).