R. Leidy

Enabling large-scale deployment of photonics through cost-efficient and scalable packaging

Tymon Barwicz, Swetha Kamlapurkar, Yves Martin, 2015, 2015 IEEE 12th International Conference on Group IV Photonics (GFP).

SiGe HBTs in 90nm BiCMOS technology demonstrating 300GHz/420GHz fT/fMAX through reduced Rb and Ccb parasitics

V. Jain, B. Zetterlund, D. L. Harame, 2013, 2013 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM).

A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities

Tymon Barwicz, Swetha Kamlapurkar, Yves Martin, 2016, IEEE Journal of Selected Topics in Quantum Electronics.

An integrated silicon photonics technology for O-band datacom

J. C. Rosenberg, W. M. J. Green, C. Xiong, 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

Automated, high-throughput photonic packaging

Tymon Barwicz, Swetha Kamlapurkar, Alexander Janta-Polczynski, 2018 .

Integrated Metamaterial Interfaces for Self-Aligned Fiber-to-Chip Coupling in Volume Manufacturing

Tymon Barwicz, Swetha Kamlapurkar, Sebastian Engelmann, 2019, IEEE Journal of Selected Topics in Quantum Electronics.